Key Highlights

  • Full front-end design, synthesis and physical design completed,now at final GDS stage
  • Advanced 16nm ultra-low-power Edge-AI SoC, purpose-built for always-on intelligent sensing
  • Integrated Bluetooth Low Energy (BLE) removes the need for external wireless ICs, reducing BOM and system complexity
  • Expanded on-chip SRAM supports larger neural networks and higher-throughput workloads
  • New fine-grained power-management architecture supports microsecond wake-up without DVFS
  • Dedicated AI accelerator optimised for lightweight object detection and edge-vision workloads

Link to the Announcement: Click Here