Key Highlights

  • ECS-DoT drone testing boosted flight time by 60% across multiple drone types at<1mW power
  • 16nm chip development advanced to fabrication stage with TSMC’s FinFET, tape-out expected Q4 CY25
  • U.S. OTCQB dual listing completed under ticker “NNVUF” to expand investor access
  • Manufacturer reps appointed across U.S. OEM hubs for ECS-DoT SoC design-ins
  • $3.4M in strategic funding secured for growth and chip development

Link to the Announcement: Click Here