Key Highlights

  • EMASS completes tape-out of 16nm ECS-DoT SoC, now entering fabrication at TSMC
  • Major milestone moving from final design to production silicon at an advanced node.
  • Scales proven 22nm platform with higher compute density, more memory & deeper integration
  • 22nm ECS-DoT already commercial, providing clear upgrade path to 16nm
  • Integrated BLE, expanded SRAM, dedicated AI acceleration & FP16/FP32 FPU
  • Full software compatibility maintained across ECS-DoT generations
  • Strengthens Nanoveu’s Atoms-to-Apps silicon roadmap

Link to the Announcement: Click Here